12inch zuru oke akpaaka nkenke dicing hụrụ akụrụngwa Wafer raara onwe ya nye maka Si/SiC & HBM (Al)

Nkọwa dị mkpirikpi:

Ngwa dicing nkenke zuru oke na akpaka bụ sistemụ ịkpụchasị oke nke emepụtara maka ụlọ ọrụ semiconductor na akụrụngwa eletrọnịkị. Ọ na-agụnye teknụzụ njikwa ngagharị dị elu yana n'ọnọdu anya nke nwere ọgụgụ isi iji nweta izi ezi nhazi ọkwa micron. Ngwa a dabara adaba maka dicing nkenke nke ihe dị iche iche siri ike na nke na-emebi emebi, gụnyere:
1.Semiconductor Ihe: Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), lithium tantalate / lithium niobate (LT / LN) substrates, wdg.
2.Packaging Materials: Seramic substrates, QFN / DFN frames, BGA nkwakọ ngwaahịa.
3.Functional Devices: Ihe nzacha ihe nzacha na-ekpo ọkụ (SAW), modul jụrụ oyi, WLCSP wafers.

XKH na-enye nnwale ndakọrịta ihe yana ọrụ nhazi nhazi iji hụ na akụrụngwa dabara n'ụzọ zuru oke mkpa mmepụta nke ndị ahịa, na-ebuga ezigbo azịza maka ma R&D samples na nhazi nhazi.

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Atụmatụ

Usoro nka

Oke	Nkọwapụta
Ogo ọrụ	Φ8", Φ12"
Spindle	Abụọ-axis 1.2/1.8/2.4/3.0, Max 60000 rpm
Nha agụba	2" ~ 3"
Y1/Y2 Axis	Mmụba otu nzọụkwụ: 0.0001 mm
	Izi ezi n'ọkwa: <0.002 mm
	Oke ịkpụ: 310 mm
Axis X	Oke ọsọ nri: 0.1-600 mm/s
Z1 / Z2 Axis	Mmụba otu nzọụkwụ: 0.0001 mm
Z1 / Z2 Axis	Ndokwa ziri ezi: ≤ 0.001 mm
θ Axis	Ndokwa ziri ezi: ± 15"
Ebe nhicha	Ọsọ ntụgharị: 100-3000 rpm
Ebe nhicha	Usoro nhicha: sachaa akpaaka & kpochaa
Voltaji na-arụ ọrụ	3-adọ 380V 50Hz
Akụkụ (W×D×H)	1550×1255×1880 mm
Ibu	2100 n'arọ

Ụkpụrụ ọrụ

Akụrụngwa na-enweta mbelata nkenke dị elu site na teknụzụ ndị a:
1.High-Rigidity Spindle System: Ntugharị na-agba ọsọ ruo 60,000 RPM, nke a na-eji akwa diamond ma ọ bụ isi ịkpụ laser iji mee mgbanwe na ihe onwunwe dị iche iche.

2.Multi-Axis Motion Control: X / Y / Z-axis nhazi ziri ezi nke ± 1μm, jikọtara ya na ọnụ ọgụgụ dị elu nke grating dị elu iji hụ na ụzọ nkwụsị na-enweghị isi.

3.Intelligent Visual Alignment: CCD dị elu (5 megapixels) na-achọpụta na-egbutu okporo ụzọ ma na-akwụ ụgwọ maka mgbagha ihe ma ọ bụ nkwụsịtụ.

4.Cooling & Dust Removal: Integrated dị ọcha mmiri jụrụ usoro na agụụ mmịpụta uzuzu na-ebelata mmetụta okpomọkụ na urughuru ofufe.

Ụdị ịkpụ

1.Blade Dicing: Kwesịrị ekwesị maka ihe semiconductor omenala dị ka Si na GaAs, na obosara kerf nke 50-100μm.

2.Stealth Laser Dicing: Ejiri ya maka wafers ultra-thin (<100μm) ma ọ bụ ihe ndị na-emebi emebi (dịka, LT / LN), na-eme ka nkewa na-enweghị nchekasị.

Ngwa a na-ahụkarị

Ngwa dakọtara	Ubi ngwa	Ihe nhazi chọrọ
Silikon (Si)	ICs, ihe mmetụta MEMS	Mbelata nkenke dị elu, mgbapu <10μm
Silicon Carbide (SiC)	Ngwaọrụ ike (MOSFET/diodes)	Mbelata mmebi dị ala, njikwa njikwa okpomọkụ
Gallium Arsenide (GaAs)	Ngwa RF, ibe optoelectronic	Mgbochi micro-crack, njikwa ịdị ọcha
Ngwa LT/LN	Ihe nzacha SAW, ndị modulators anya	Mbelata na-enweghị nchekasị, na-echekwa akụrụngwa piezoelectric
Ngwa seramiiki	Modul ike, nkwakọ ngwaahịa LED	Nhazi ihe siri ike dị elu, ọnụ ọnụ
Frames QFN/DFN	Nkwakọ ngwaahịa dị elu	Multi-mgbawa n'out oge ọnwụ, arụmọrụ njikarịcha
WLCSP Wafers	Nkwakọ ngwaahịa ọkwa wafer	Ngwunye wafers dị obere (50μm) na-enweghị mmebi.

Uru

1. Igwe onyonyo cassette dị elu na-enyocha ihe mgbochi mgbochi, ntinye ngwa ngwa mbufe, yana ike mmezi njehie siri ike.

2. Kachasị mma abụọ-spindle ịkpụ mode, na-eme ka arụmọrụ dị ka 80% tụnyere otu-spindle usoro.

3. Kpọrọ bọọlụ na-ebubata nkenke, ntuziaka linear, na Y-axis grating scale mechiri emechi, na-eme ka nkwụsi ike ogologo oge nke nrụpụta dị elu.

4. Nbudata / nbudata na-akpaghị aka zuru oke, ntinye mbufe, ịkpụ nhazi, na nyocha kerf, na-ebelata ọrụ ọrụ (OP).

5.Gantry-style spindle arịọnụ Ọdịdị, na a kacha nta dual-agụba spacing nke 24mm, na-enyere sara mbara adaptability maka dual-spindle ọnwụ Filiks.

Atụmatụ

1.High-nkenke na-abụghị kọntaktị elu nha.

2.Multi-wafer dual-blade ọnwụ na otu tray.

3.Automatic calibration, kerf inspection, and blade breakage detection systems.

4.Supports iche iche usoro na selectable akpaka alignment algọridim.

5.Fault onwe-mmezi arụmọrụ na ezigbo oge multi-ọnọdụ nlekota oru.

6.First-cut nnyocha ike post-mmalite dicing.

7.Customizable factory akpaaka modul na ndị ọzọ nhọrọ ọrụ.

Ngwa dakọtara

Ngwa akụrụngwa

Anyị na-enye nkwado zuru oke site na nhọrọ akụrụngwa ruo nrụzi ogologo oge:

(1) Mmepe ahaziri ahazi
Na-atụ aro ka agụba/Laser ngwọta dabere na ihe onwunwe (dịka, SiC hardness, GaAs brittleness).

· Na-enye nnwale nlele n'efu iji nyochaa ịdị mma ịkpụ (gụnyere chipping, obosara kerf, adịghị ike elu, wdg).

(2) Ọzụzụ nka nka
Ọzụzụ ndị bụ isi: Arụ ọrụ akụrụngwa, ngbanwe oke, mmezi oge niile.
Usoro mmụta dị elu: njikarịcha usoro maka ihe ndị dị mgbagwoju anya (dịka ọmụmaatụ, ịkpụ mkpụrụ LT na-enweghị nchekasị).

(3) Nkwado mgbe-ire ahịa
· 24/7 Azịza: Nchọpụta nyocha dịpụrụ adịpụ ma ọ bụ enyemaka saịtị.
Nnweta akụkụ mapụtara: spindles, agụba, na ngwa anya maka nnọchi ngwa ngwa.
· Nlekọta mgbochi: Nhazi oge niile iji kwado izi ezi na ịgbatị ndụ ọrụ.

90bf3f9d-353c-408a-a-a804-56eb276dea24_副本

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