Ngwa mgbanaka wafer na-akpaghị aka na-arụ ọrụ nha 8inch/12inch wafer mgbanaka ịkpụ.

Ngwa mgbanaka wafer na-akpaghị aka na-arụ ọrụ nha 8inch/12inch Wafer mgbanaka egosipụtara

Nkọwa dị mkpirikpi:

XKH ewepụtala sistemu mbelata ihu wafer kpamkpam, na-anọchite anya ihe ngwọta dị elu emebere maka usoro nrụpụta semiconductor n'ihu. Akụrụngwa a na-ejikọta teknụzụ njikwa njikwa multi-axis synchronous multi-axis yana atụmatụ sistemụ spindle siri ike (ọsọ ntụgharị kacha elu: 60,000 RPM), na-ebuga mkpụkọ nke ọma na igbutu ziri ezi ruo ± 5μm. Sistemu na-egosipụta ezigbo ndakọrịta dị iche iche na substrates semiconductor, gụnyere mana ọnweghị oke na:
1.Silicon wafers (Si): Kwesịrị ekwesị maka nhazi ihu nke 8-12 inch wafers;
2.Compound semiconductor: ihe nke atọ semiconductor ihe dị ka GaAs na SiC;
3.Special substrates: Piezoelectric ihe wafers gụnyere LT / LN;

Nhazi modular na-akwado ngbanwe ngwa ngwa nke ọtụtụ ihe eji eme ihe gụnyere eriri diamond na isi ịcha laser, yana ndakọrịta karịrị ụkpụrụ ụlọ ọrụ. Maka usoro chọrọ pụrụ iche, anyị na-enye azịza zuru oke gụnyere:
· Raara onwe ya nye ọnwụ consumables ọkọnọ
· Ọrụ nhazi omenala
· Ngwọta kachasị mma usoro

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Atụmatụ

Usoro nka

Oke	Nkeji	Nkọwapụta
Oke arụrụ arụ ọrụ	mm	ø12"
Spindle	Nhazi	Otu Spindle
	Ọsọ	3,000-60,000 rpm
	Ike mmepụta	1.8 kW (2.4 nhọrọ) na 30,000 min⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	Oke oke	310 mm
Y-axis	Oke oke	310 mm
	Nkwalite nzọụkwụ	0.0001 mm
	Ndokwa nke ziri ezi	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (otu njehie)
Z-Axis	Mkpebi ngagharị	0.00005 mm
Z-Axis	Nkwagharị ugboro ugboro	0.001 mm
θ-Axis	Oke ntụgharị	380 deg
Ụdị Spindle		Otu mkpịsị mkpịsị aka, nke nwere agụba siri ike maka ịkpụ mgbanaka
Izi ezi mbelata mgbanaka	μm	±50
Ndozi wafer ziri ezi	μm	±50
Ịrụ otu Wafer	min/wafer	8
Ịrụ Ọrụ Multi-Wafer		A na-edozi ihe ruru wafer 4 n'otu oge
Akụrụngwa arọ	kg	≈3,200
Akụkụ akụrụngwa (W×D×H)	mm	2,730 × 1,550 × 2,070

Ụkpụrụ ọrụ

Sistemu na-enweta arụmọrụ mbelata pụrụ iche site na teknụzụ ndị a bụ isi:

1.Intelligent Motion Control System:
Mbanye moto ahịrị kwụ ọtọ dị elu ( kwugharịa izi ezi: ± 0.5μm)
· njikwa synchronous nke axis isii na-akwado atụmatụ trajectory dị mgbagwoju anya
· Real-oge vibration suppress algọridim n'ịhụ ọnwụ nkwụsi ike

2. Advanced Nchọpụta Sistemụ:
Ihe mmetụta ịdị elu laser 3D jikọtara ọnụ (nke ziri ezi: 0.1μm)
Ndokwa n'ọhụụ CCD dị elu (5 megapixels)
· Module nyocha ogo dị n'ịntanetị

3. Usoro akpaaka zuru oke:
Nbudata/ebutu akpaaka (ọkọlọtọ FOUP dakọtara)
· Usoro nhazi ọgụgụ isi
· Ngalaba nhicha mechiri emechi (ịdị ọcha: Klas 10)

Ngwa a na-ahụkarị

Akụrụngwa a na-enye uru dị ukwuu n'ofe ngwa nrụpụta semiconductor:

Ubi ngwa	Ngwa usoro	Uru nka
Nrụpụta IC	8/12 "Silicon Wafers	Na-akwalite nhazi nke lithography
Ngwaọrụ Ike	SiC/GaN Wafers	Na-egbochi ntụpọ ihu
Ihe mmetụta MEMS	SOI Wafers	Na-akwado ntụkwasị obi ngwaọrụ
Ngwa RF	GaAs Wafers	Na-eme ka arụmọrụ dị elu dị elu
Nkwakọ ngwaahịa dị elu	Wafers arụgharịrị	Na-abawanye mkpụrụ nkwakọ ngwaahịa

Atụmatụ

1.Four-station nhazi maka elu nhazi arụmọrụ;
2.Stable TAIKO mgbanaka debonding na mwepụ;
3.High ndakọrịta na isi consumables;
4.Multi-axis synchronous trimming technology ana achi achi nkenke onu ọnwụ;
5.Fully akpaghị aka usoro eruba budata ebelata ọrụ ụgwọ;
6.Customized worktable imewe na-enyere kwụsie ike nhazi nke pụrụ iche owuwu;

Ọrụ

1.Mgbanaka-dobe nchọpụta usoro;
2.Automatic worktable nhicha;
3.Intelligent UV debonding usoro;
4.Operation ndekọ ndekọ;
5.Factory akpaaka modul mwekota;

Nkwenye ọrụ

XKH na-enye ọrụ nkwado zuru oke nke ndụ okirikiri emebere iji bulie arụmọrụ akụrụngwa yana arụmọrụ arụ ọrụ n'oge njem mmepụta gị.
1. Ọrụ nhazi
· Nhazi akụrụngwa ahaziri ahazi: Ndị otu injinia anyị na ndị ahịa na-arụkọ ọrụ ọnụ iji bulie usoro sistemụ (ịcha ọsọ, nhọrọ agụba, wdg) dabere na akụrụngwa akụrụngwa akọwapụtara (Si / SiC / GaAs) na usoro chọrọ.
· Nkwado Mmepe Usoro: Anyị na-enye nhazi nlele na akụkọ nyocha zuru ezu gụnyere nha roughness na maapụ ntụpọ.
· Mmepụta ihe eji eme ihe: Maka ihe ọhụrụ (dịka ọmụmaatụ, Ga₂O₃), anyị na ndị na-emepụta ihe na-emepụta ihe na-arụkọ ọrụ iji mepụta agụba / laser optics akọwapụtara ngwa.

2. Nkwado nka na ụzụ ọkachamara
Nkwado na saịtị raara onwe ya nye: Kenye ndị injinia agbaziri agbaziri maka usoro mgbago dị oke egwu (nke na-abụkarị izu 2-4), na-ekpuchi:
Nhazi akụrụngwa & nhazi nke ọma
Ọzụzụ ikike onye ọrụ
Ntuziaka ntinye ụlọ dị ọcha ISO Class 5
· Mmezi amụma: Nyocha ahụike nke nkeji nkeji na nyocha vibration na nchọpụta moto servo iji gbochie oge ọdịda na-enweghị atụmatụ.
Nleba anya n'ime anya: nleba anya arụmọrụ akụrụngwa n'oge site na ikpo okwu IoT anyị (JCFront Connect®) nwere ọkwa anomaly akpaaka.

3. Ọrụ agbakwunyere ọnụ ahịa
Usoro ihe ọmụma usoro: Nweta 300+ ezi ntụziaka ịkpụchasị mma maka ihe dị iche iche (emelitere kwa nkeji iri na ise).
Nhazi okporo ụzọ teknụzụ: Ọdịnihu jiri ụzọ nkwalite ngwaike/software gosi itinye ego gị (dịka ọmụmaatụ, modul nchọpụta ntụpọ dabere AI).
· Nzaghachi ihe mberede: achọpụtara nchoputa dịpụrụ adịpụ nke awa 4 na awa 48 na saịtị (nkpuchi zuru ụwa ọnụ).

4. Akụrụngwa ọrụ
· Nkwenye arụmọrụ: Nkwekọrịta nkwekọrịta na ≥98% ngwa ngwa na oge nzaghachi SLA na-akwado.

Mmelite na-aga n'ihu

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