Ugboro abụọ ọdụ square igwe monocrystalline silicon mkpanaka nhazi 6/8/12 inch elu flatness Ra≤0.5μm

Igwe igwe monocrystalline silicon mkpanaka nhazi okpukpu abụọ ọdụ ụgbọ elu 6/8/12 inch elu flatness Ra≤0.5μm Foto egosipụtara

Nkọwa dị mkpirikpi:

Monocrystalline silicon double station square igwe bụ akụrụngwa na-arụ ọrụ nke ọma maka nhazi nke mkpanaka silicon monocrystalline (Ingot). Ọ na-anakwere imewe ọrụ synchronous ọdụ ọdụ abụọ ma nwee ike ibelata mkpanaka silicon abụọ n'otu oge, na-eme ka nrụpụta nrụpụta nke ukwuu. Ngwaọrụ ahụ na-arụ ọrụ mkpanaka silicon cylindrical n'ime square / quasi-square silicon blocks (Grit) site na teknụzụ ịcha waya diamond ma ọ bụ oghere okirikiri dị n'ime, na-akwadebe maka slicing na-esote (dị ka ịme silicon wafers), a na-ejikwa ya na njikọ nhazi silicon na ụlọ ọrụ fotovoltaic na semiconductor.

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Nkọwa ngwaahịa

Mkpado ngwaahịa

Njirimara akụrụngwa:

(1) Nhazi mekọrịta ọdụ ọdụ abụọ
· Ugboro abụọ arụmọrụ: Nhazi oge nke abụọ silicon mkpara (Ø6"-12") na-abawanye arụpụtaghị site 40% -60% vs. Simplex ngwá.

· Njikwa onwe: ọdụ ụgbọ ala ọ bụla nwere ike ịhazigharị akụkụ nke ịkpụ (mgbagwoju anya, ọsọ nri) iji mee mgbanwe na nkọwa mkpanaka silicon dị iche iche.

(2) Mbelata nkenke dị elu
· Akụkụ ziri ezi: square mmanya n'akụkụ anya ndidi ± 0.15mm, nso ≤0.20mm.

· Àgwà elu: mbelata nkwụsịtụ <0.5mm, belata ọnụ ọgụgụ nke egweri na-esote.

(3) njikwa ọgụgụ isi
· Mbelata ihe na-agbanwe agbanwe: nleba anya n'ezie nke silicon mkpanaka morphology, mgbanwe dị ike nke ụzọ ịkpụ (dị ka nhazi eriri silicon bent).

Ihe nchọta data: dekọọ paramita nhazi nke mkpanaka silicon ọ bụla iji kwado docking sistemụ MES.

(4) Ọnụ ego erimeri dị ala
· Oriri waya diamond: ≤0.06m/mm (ogologo mkpanaka silicon), dayameta waya ≤0.30mm.

· Mgbasa oyi: Usoro nzacha na-agbatị ndụ ọrụ ma belata mkpofu mmiri mmiri.

Uru teknụzụ na mmepe:

(1) Ịcha teknụzụ kacha mma
- Multi-line ọnwụ: 100-200 diamond ahịrị na-eji yiri, na ọnwụ ọsọ bụ ≥40mm / min.

- Nchekwa nchekasị: Sistemụ nhazi nhazi nke mechiri emechi (± 1N) iji belata ihe ize ndụ nke ịgbaji waya.

(2) Mgbatị ndakọrịta
- Ngbanwe ihe: Nkwado silicon ụdị P-ụdị / N-ụdị monocrystalline, dakọtara na TOPCon, HJT na mkpanaka silicon batrị ndị ọzọ dị elu.

- Mgbanwe size: silicon mkpanaka ogologo 100-950mm, square mkpanaka akụkụ anya 166-233mm mgbanwe.

(3) nkwalite akpaaka
- Nbudata na nbudata robot: ntinye akpaaka / nbudata nke mkpanaka silicon, tie ≤3 nkeji.

- Nchọpụta ọgụgụ isi: Nlekọta amụma iji belata oge ezumike na-enweghị atụmatụ.

(4) Ndị isi ụlọ ọrụ
- Nkwado Wafer: nwere ike hazie ≥100μm ultra-thin silicon na mkpanaka mkpanaka, ọnụego mbelata <0.5%.

- Nkwalite oriri ike: ike oriri kwa nkeji nke mkpanaka silicon na-ebelata 30% (vs. ngwa ọdịnala).

Nka nka:

Aha oke	Uru ndeksi
Ọnụọgụ mmanya ahaziziri	2 iberibe / set
Ogologo ogologo mmanya na-arụ ọrụ	100-950mm
Oke oke igwe	166-233mm
Ịcha ọsọ	≥40mm/min
Ọsọ waya diamond	0 ~ 35m/s
Dayameta diamond	0.30 mm ma ọ bụ obere
Oriri ahịrị	0.06 m / mm ma ọ bụ obere
Dayameta mkpanaka gburugburu dakọtara	Dayameta mkpanaka mkpanaka agwụla +2mm, Gbaa mbọ hụ na ọnụego ngafe polishing
Mbelata nbibi njikwa	Raw onu ≤0.5mm, Enweghị chipping, elu elu mma
Iri n'ogologo Arc	Ogologo amụma <1.5mm, Ewezuga mgbagha mkpanaka silicon
Akụkụ igwe (otu igwe)	4800×3020×3660mm
Mkpokọta ike gosiri	56kW
Nwụrụ anwụ arọ nke akụrụngwa	12t

Tebụlụ nrịbama nke nrụpụta ziri ezi:

Ihe nkenke	Oke nnabata
Nkwenye oke mmanya square	± 0.15mm
Ogwe ihu akụkụ square	≤0.20mm
Akụkụ n'akụkụ niile nke mkpanaka square	90°±0.05°
Flatness nke square mkpanaka	≤0.15mm
Robot kwụziri izi ezi ugboro ugboro	± 0.05mm

Ọrụ XKH:

XKH na-enye ọrụ okirikiri zuru oke maka igwe mono-crystalline silicon dual- stations, gụnyere nhazi ngwa ngwa (dakọtara na nnukwu mkpanaka silicon), nhazi usoro (ịchacha mma mma), ọzụzụ arụ ọrụ na nkwado ahịa mgbe emechara (nchịkọta akụkụ isi, nchọpụta dịpụrụ adịpụ), na-eme ka ndị ahịa nweta nnukwu mkpụrụ (> 99%) na mmepụta ọnụ ahịa dị ala, na inye nkwalite teknụzụ dị ka AI. Oge nnyefe bụ ọnwa 2-4.