Uru nkeSite na Glass Via (TGV)Usoro site na Silicon Via (TSV) na TGV bụ isi ihe ndị a:
(1) njirimara eletriki dị elu nke ukwuu. Ihe iko bụ ihe mkpuchi, ihe na-agbanwe agbanwe dielectric dị naanị ihe dịka 1/3 nke ihe silicon, ihe na-efunahụ ihe dị ka nha 2-3 dị ala karịa nke ihe silicon, nke na-eme ka mfu substrate na mmetụta nje belata nke ukwuu ma na-eme ka ihe mgbaàmà ebufere sie ike;
(2)nnukwu nha na ihe mkpuchi iko dị oke mkpadị mfe inweta. Corning, Asahi na SCHOTT na ndị ọzọ na-emepụta iko nwere ike inye iko panel buru ibu (>2m × 2m) na iko panel dị gịrịgịrị (<50µm) na ihe iko na-agbanwe agbanwe dị gịrịgịrị.
3) Ọnụ ego dị ala. Rite uru site na ịnweta iko panel buru ibu nke dị oke mkpa, ọ chọghịkwa ka e tinye akwa mkpuchi, ọnụ ahịa mmepụta nke efere nkwụnye iko bụ naanị ihe dị ka 1/8 nke efere nkwụnye silicon;
4) Usoro dị mfe. Ọ dịghị mkpa itinye akwa mkpuchi n'elu ihe mkpuchi na mgbidi dị n'ime TGV, ọ dịghịkwa mkpa ịcha ihe n'ime efere ihe nkwụnye dị oke mkpa;
(5) Nkwụsi ike siri ike nke igwe. Ọbụlagodi mgbe ọkpụrụkpụ nke efere ihe nkwụnye ahụ erughị 100µm, ihe agha ahụ ka dị obere;
(6) Ngwa dị iche iche, bụ teknụzụ njikọ ogologo oge na-apụta nke ejiri mee ihe n'ọhịa nke nkwakọ ngwaahịa ọkwa wafer, iji nweta anya kacha nta n'etiti wafer-wafer, obere oghere nke njikọ ahụ na-enye ụzọ teknụzụ ọhụrụ, yana ezigbo eletriki, okpomọkụ, akụrụngwa, na chip RF, sensọ MEMS dị elu, njikọta sistemụ njupụta dị elu na mpaghara ndị ọzọ nwere uru pụrụ iche, bụ ọgbọ na-esote nke 5G, 6G chip ugboro ugboro 3D Ọ bụ otu n'ime nhọrọ mbụ maka nkwakọ ngwaahịa 3D nke chips ugboro ugboro 5G na 6G ọgbọ na-esote.
Usoro ịkpụzi TGV gụnyerekarị ịkpụcha ájá, igwu mmiri ultrasonic, ịkpụcha mmiri mmiri, ịkpụcha ion miri emi, ịkpụcha fotosensitive, ịkpụcha laser, ịkpụcha omimi nke laser kpatara, na ịmepụta oghere mwepụta na-elekwasị anya.
Nnyocha na mmepe emere n'oge na-adịbeghị anya gosiri na teknụzụ ahụ nwere ike ịkwadebe site na oghere na oghere kpuru ìsì 5:1 nke nwere oke omimi ruo obosara nke 20:1, ma nwee ezigbo ọdịdị. Ịkpụcha miri emi nke laser na-akpata, nke na-ebute obere ihe isi ike n'elu, bụ ụzọ a kacha amụ ugbu a. Dịka egosiri na Foto 1, enwere mgbawa doro anya gburugburu olulu laser nkịtị, ebe mgbidi gbara ya gburugburu na akụkụ nke nkụcha miri emi nke laser kpatara dị ọcha ma dị ire ụtọ.
Usoro nhazi nkeTGVE gosiri ihe na-etinye ihe n'ime oghere na eserese nke abụọ. Usoro zuru oke bụ ịgba oghere na ihe mkpuchi iko ahụ, wee tinye akwa mgbochi na oyi akwa mkpụrụ n'akụkụ mgbidi na elu ya. Ihe mkpuchi ahụ na-egbochi mgbasa nke Cu na ihe mkpuchi iko ahụ, ebe ọ na-eme ka njikọta nke abụọ dịkwuo elu, n'ezie, n'ọmụmụ ihe ụfọdụ achọpụtakwara na oyi akwa mgbochi ahụ adịghị mkpa. Mgbe ahụ, a na-etinye Cu ahụ site na electroplating, wee mee ka ọ dị nro, CMP na-ewepụkwa oyi akwa Cu ahụ. N'ikpeazụ, a na-akwadebe oyi akwa rewiring RDL site na lithography mkpuchi PVD, a na-emepụtakwa oyi akwa passivation mgbe ewepụsịrị gluu ahụ.
(a) Nkwadebe nke wafer, (b) nhazi nke TGV, (c) electroplating nke nwere akụkụ abụọ - itinye ọla kọpa, (d) ime ka a na-anyụcha na CMP polishing kemịkalụ, iwepụ oyi akwa ọla kọpa elu, (e) mkpuchi PVD na lithography, (f) itinye oyi akwa rewiring RDL, (g) iwepụ gluu na Cu/Ti etching, (h) ịmepụta oyi akwa passivation.
Na mkpokọta,oghere iko gafere (TGV)atụmanya ngwa dị sara mbara, ahịa ime obodo dị ugbu a nọkwa n'ọkwa na-arị elu, site na akụrụngwa ruo na imepụta ngwaahịa yana ọnụego uto nyocha na mmepe dị elu karịa nkezi ụwa.
Ọ bụrụ na enwere mmebi iwu, hichapụ kọntaktị
Oge ozi: Julaị-16-2024