Wafer Silikọn nke e ji ígwè kpuchie Ti/Cu (Titanium/Copper)

Foto a kpụrụ akpụ nke a na-akpọ Ti/Cu Silicon Wafer nke e ji ígwè kpuchie (Titanium/Copper)

Nkọwa Dị Mkpirikpi:

Nke anyịWafịịl silik a kpụchara ígwè nke Ti/Cunwere ihe mkpuchi silicon dị elu (ma ọ bụ iko/quartz nhọrọ) nke a kpuchiri naoyi akwa njikọta titaniumna aoyi akwa na-eduzi ọla kọpana-ejiọkọlọtọ magnetron sputteringNkewa Ti na-eme ka njikọ na nkwụsi ike nke ọma dịkwuo mma, ebe akwa elu Cu na-enye elu dị ala, nke zuru oke maka njikọta eletriki na obere ihe eji emepụta ihe.

Zitere anyị ozi-e

atụmatụ

Ihe osise zuru ezu

Wafer Silikọn nke e ji ígwè kpuchie Ti/Cu (Titanium/Copper)6

Nchịkọta

E mere ya maka nyocha na ngwa nnwale, a na-enweta wafer ndị a n'ọtụtụ nha na oke iguzogide ọrịa, yana nhazi mgbanwe maka ọkpụrụkpụ, ụdị substrate, na nhazi mkpuchi.

Isi Atụmatụ

Nrapado siri ike na ntụkwasị obi: Ibe njikọ Ti na-eme ka ihe nkiri ahụ na-arapara na Si/SiO₂ ma na-eme ka njikwa sie ike ka mma
Elu conductivity dị eluMkpuchi Cu na-enye arụmọrụ eletriki dị mma maka kọntaktị na nhazi ule
Oke nhazi sara mbara: nha wafer, nguzogide, nhazi, ọkpụrụkpụ substrate, na ọkpụrụkpụ fim dị ma ọ bụrụ na achọrọ ya
Ihe ndị dị njikere maka usoro: dakọtara na usoro ọrụ nyocha nkịtị na nke dị mfe (lithography, nhazi electroplating, metrology, wdg)
Usoro ihe dị: e wezụga Ti/Cu, anyị na-enyekwa Au, Pt, Al, Ni, Ag wafers e ji ígwè kpuchie

Nhazi na Ndozi A Na-ahụkarị

Stak: Substrate + Ti adhesion oyi akwa + Cu mkpuchi oyi akwa
Usoro ọkọlọtọ: Ịkụnye magnetron
Usoro nhọrọ: Ọkụ ikuku / Electroplating (maka ihe Cu siri ike)

Njirimara Mechanical nke Quartz Glass

ihe	Nhọrọ
Nha wafer	2", 4", 6", 8"; 10×10 mm; nha ịkpụzi omenala
Ụdị conductivity	Ụdị P / Ụdị N / N-eguzogide ọgwụ dị elu n'ime (Un)
Nhazi	<100>, <111>, wdg.
Nguzogide	<0.0015 Ω·cm; 1–10 Ω·cm; > 1000–10000 Ω·cm
Ọkpụrụkpụ (µm)	2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; omenala
Ihe ndị e ji mee ihe	Silikọn; quartz nhọrọ, iko BF33, wdg.
Ọkpụrụkpụ nke ihe nkiri ahụ	10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (enwere ike ịhazi ya)
Nhọrọ ihe nkiri ígwè	Ti/Cu; nakwa Au, Pt, Al, Ni, Ag dị

Wafer Silikọn nke e ji ígwè kpuchie Ti/Cu (Titanium/Copper)4

Ngwa

Njikọ Ohmic na ihe ndị na-eduzi ihemaka R&D ngwaọrụ na nnwale eletriki
Mkpụrụ osisi maka electroplating(RDL, nhazi MEMS, mkpokọta Cu dị oke arọ)
Mkpụrụ osisi na ihe ndị na-eto eto nke Sol-gel na nanomaterialmaka nyocha nano na obere ihe nkiri
Mikroskopu na usoro mbara ala(Nkwadebe na nha ihe nlele SEM/AFM/SPM)
Elu bio/kemikaldịka ikpo okwu ọdịbendị mkpụrụ ndụ, obere ihe ngosi protein/DNA, na ihe ndị na-egosi reflectometry

FAQ (Ti/C Metal-Sịlicon Wafers)

Q1: Gịnị mere e ji eji oyi akwa Ti n'okpuru mkpuchi Cu?
A: Titanium na-arụ ọrụ dị ka iheoyi akwa njikọta (njikọ), na-eme ka njikọ ọla kọpa na ihe ndị dị n'elu ala dịkwuo mma ma na-eme ka njikọ ahụ kwụsie ike, nke na-enyere aka belata mkpụcha ma ọ bụ delamination n'oge a na-ejikwa ma na-ahazi ya.

Q2: Kedu nhazi ọkpụrụkpụ Ti/Cu a na-ahụkarị?
A: Nchikota ndị a na-ahụkarị gụnyereTi: iri nke nm (dịka ọmụmaatụ, 10–50 nm)naCu: 50–300 nmmaka ihe nkiri ndị a fụpụrụ afụ. A na-enweta oyi akwa Cu dị oke ibu (µm-ọkwa) site naElektroplating na oyi akwa mkpụrụ Cu a gbapụrụ agbapụ, dabere na ngwa gị.

Q3: Ị nwere ike itinye akwa wafer ahụ n'akụkụ abụọ ya?
A: Ee.Mkpuchi otu akụkụ ma ọ bụ okpukpu abụọdị ma ọ bụrụ na ị rịọ ya. Biko dee ihe ị chọrọ mgbe ị na-enye iwu.

Gbasara anyị

XKH bụ ọkachamara n'ihe gbasara mmepe teknụzụ dị elu, mmepụta, na ire nke iko anya pụrụ iche na ihe kristal ọhụrụ. Ngwaahịa anyị na-enye ngwa eletrọnịkị anya, ngwa eletrọnịkị ndị ahịa, na ndị agha. Anyị na-enye ihe ndị mejupụtara anya Sapphire, mkpuchi anya ekwentị mkpanaaka, seramiiki, LT, Silicon Carbide SIC, Quartz, na wafers kristal semiconductor. Site na ahụmịhe nwere nkà na ngwa ọgbara ọhụrụ, anyị na-eme nke ọma na nhazi ngwaahịa na-abụghị ọkọlọtọ, na-achọ ịbụ ụlọ ọrụ teknụzụ dị elu nke ihe optoelectronic.