Ngwa Semiconductor Laser Lift-Off Na-agbanwe Ingot Thinning

Ngwa ihe na-ebuli ihe ọkụ laser nke Semiconductor na-agbanwe onyonyo egosipụtara na-adị mkpa nke Ingot.

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Ngwa Semiconductor Laser Lift-Off Equipment bụ ihe nrụpụta ụlọ ọrụ pụrụ iche emebere maka nkenke na enweghị kọntaktị mkpa nke semiconductor ingots site na teknụzụ ebuli laser. Usoro a dị elu na-arụ ọrụ dị mkpa n'ime usoro ịmegharị semiconductor ọgbara ọhụrụ, ọkachasị n'ichepụta wafers dị mkpa maka ngwa eletrọnịkị dị elu, LEDs na ngwaọrụ RF. Site n'ime ka ikewa nkewa dị gịrịgịrị site na nnukwu ingots ma ọ bụ ihe ndị na-enye onyinye, Semiconductor Laser Lift-Off Equipment na-eme mgbanwe nke ingot thinning site na iwepu usoro ịwa osisi, ichicha, na usoro etching kemịkalụ.

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Mmalite ngwaahịa nke ihe nrụpụta Laser Semiconductor Laser Equipment

Omenala thinning nke semiconductor ingots, dị ka gallium nitride (GaN), silicon carbide (SiC), na sapphire, na-emekarị na-arụsi ọrụ ike, na-ala n'iyi, na-adịkarị mfe microcracks ma ọ bụ n'elu mmebi. N'ụzọ dị iche, Semiconductor Laser Lift-Off Equipment na-enye ihe na-adịghị emebi emebi, nke ziri ezi nke na-ebelata mfu ihe na nrụgide elu ka ọ na-abawanye arụpụtaghị ihe. Ọ na-akwado ụdị kristal dị iche iche na ihe mejupụtara ma nwee ike itinye ya n'enweghị nsogbu n'ihu njedebe ma ọ bụ ahịrị mmepụta semiconductor nke etiti.

Site na ngbanwe laser nwere ike ịhazigharị, sistemu nlebara anya na-agbanwe agbanwe, yana oghere wafer chucks dakọtara, akụrụngwa a dabara nke ọma maka slicing ingot, okike lamella, na mwepu ihe nkiri dị nro maka ihe owuwu ngwaọrụ kwụ ọtọ ma ọ bụ mbufe oyi akwa heteroepitaxial.

Parameter nke ihe nrụpụta Laser Semiconductor

Ogologo ogologo	IR/SHG/THG/FHG
Obosara Pulse	Nanosecond, Picosecond, Femtosecond
Sistemụ ngwa anya	Sistemụ ngwa anya edobere ma ọ bụ sistemu Galvano-optical
Oge XY	500 mm × 500 mm
Oke nhazi	160 mm
Ọsọ mmegharị	Kachasị 1,000 mm / sk
Nkwagharị ugboro ugboro	± 1 μm ma ọ bụ obere
Izi ezi ọnọdụ zuru oke:	± 5 μm ma ọ bụ obere
Nha wafer	2–6 inch ma ọ bụ ahaziri
Njikwa	Windows 10,11 na PLC
Voltaji na-enye ike	AC 200 V ± 20 V, Otu oge, 50/60 kHz
Akụkụ Mpụga	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Ibu	1,000 n'arọ

Ụkpụrụ na-arụ ọrụ nke Semiconductor Laser Lift-Off Equipment

Isi usoro nke Semiconductor Laser Lift-Off Equipment na-adabere na ahọpụtara photothermal ire ere ma ọ bụ ablation na interface n'etiti ingot na-enye onyinye na epitaxial ma ọ bụ oyi akwa ebumnuche. Igwe ọkụ ọkụ UV dị elu (nke a na-ahụkarị KrF na 248 nm ma ọ bụ lasers UV siri ike gburugburu 355 nm) na-elekwasị anya site na ihe inye onyinye nghọta ma ọ bụ nke nwere ọkara, ebe a na-ahọrọ ike ya na omimi a kara aka.

Mmụba ike nke mpaghara a na-emepụta usoro ikuku nrụgide dị elu ma ọ bụ oyi akwa mgbasawanye ọkụ na interface ahụ, nke na-ebute delamination dị ọcha nke wafer dị elu ma ọ bụ oyi akwa ngwaọrụ site na ntọala ingot. A na-edozi usoro a nke ọma site n'ịgbanwe usoro dịka obosara usu, ụda laser, ọsọ nyocha, na omimi nke axis z-axis. Nsonaazụ bụ iberi dị oke mkpa - na-abụkarị n'ogo 10 ruo 50 µm - kewapụrụ nke ọma na nne na nna ingot na-enweghị mmerụ ahụ.

Usoro a nke mgbapụ laser maka ingot thinning na-ezere mfu kerf na mmebi elu jikọtara ya na ịwa waya diamond ma ọ bụ lapping n'ibu. Ọ na-echekwa iguzosi ike n'ezi ihe kristal ma na-ebelata ihe ndị chọrọ nchacha ala, na-eme Semiconductor Laser Lift-Off Equipment ka ọ bụrụ ngwa na-agbanwe egwuregwu maka mmepụta wafer nke ọgbọ na-abịa.

Ngwa Semiconductor Laser Lift-Off Na-agbanwe Ingot Thinning 2

Ngwa nke Semiconductor Laser Lift-Off Equipment

Ihe nrụpụta ihe ọkụ Laser nke Semiconductor na-ahụ na ọ dị oke mkpa na ingot thinning n'ọtụtụ ngwa na ụdị ngwaọrụ dị elu, gụnyere:

GaN na GaAs Ingot Thinning maka ngwaọrụ ike
Na-enyere ike ịmepụta wafer dị mkpa maka ịrụ ọrụ dị elu, transistors na diodes ike dị ala.

Mweghachi nke mkpụrụ osisi SiC na nkewa Lamella
Na-enye ohere ibuli ọnụ ọgụgụ wafer site na nnukwu mkpụrụ osisi SiC maka nhazi ngwaọrụ kwụ ọtọ na ijikwa wafer.

Iberibe Wafer LED
Na-eme ka ebuli elu GaN si na sapphire ingots siri ike mepụta mkpụrụ ọkụ ọkụ dị nro.

RF na nrụpụta ngwaọrụ Microwave
Na-akwado ultra-thin high-electron-mobility transistor (HEMT) ihe dị mkpa na 5G na sistemụ radar.

Epitaxial Layer Nyefee
Kpọmkwem na-ewepụ akwa epitaxial site na ingots crystalline maka ijigharị ma ọ bụ ntinye n'ime heterostructures.

Selụ anyanwụ dị obere na fotovoltaics
A na-eji ya kewapụ akwa absorber mkpa maka mkpụrụ ndụ anwụ na-agbanwe ma ọ bụ dị elu.

N'ime ngalaba ndị a nke ọ bụla, Ngwa Semiconductor Laser Lift-Off Equipment na-enye njikwa na-enweghị atụ n'otu nha nha nha, ịdị mma elu na iguzosi ike n'ezi oyi oyi.

Uru nke Ingot Thinning dabere na Laser

Ihe efu efu-Kerf
E jiri ya tụnyere ụzọ slicing wafer ọdịnala, usoro laser na-arụpụta ihe fọrọ nke nta ka ọ bụrụ 100% iji ihe onwunwe.

Obere Nchegbu na Warping
Mbuli na-enweghị kọntaktị na-ewepụ ịma jijiji n'ibu, na-ebelata ụta wafer na nhazi microcrack.

Nchekwa ogo dị elu
Enweghị ịsa akwa ma ọ bụ polishing mgbe ọ dị mkpa n'ọtụtụ ọnọdụ, ebe ọ bụ na-ebuli laser na-echekwa iguzosi ike n'ezi ihe n'elu.

Ntinye dị elu yana njikere akpaaka
Enwere ike ịhazi narị narị mkpụrụ mkpụrụ n'otu ngbanwe site na iji nbudata/ebutu akpaaka.

Enwere ike imeghari na otutu ihe
Dakọtara na GaN, SiC, sapphire, GaAs, na ihe III-V na-apụta.

Na gburugburu ebe obibi dị mma
Na-ebelata ojiji nke abrasives na kemịkalụ siri ike na-ahụkarị na usoro mkparị dabere na slurry.

Megharia mkpụrụ osisi
Enwere ike ịmegharị ingots ndị nyere onyinye maka ọtụtụ usoro mbuli elu, na-ebelata ọnụ ahịa ihe onwunwe nke ukwuu.

Ajuju a na-ajụkarị (FAQ) nke ihe nrụpụta Laser Semiconductor Laser Equipment

Q1: Kedu oke nha nke Semiconductor Laser Lift-Off Equipment nwere ike nweta maka mpekere wafer?
A1:Ọkpụrụkpụ iberi a na-ahụkarị sitere na 10 µm ruo 100 µm dabere na ihe na nhazi ya.

Q2: Enwere ike iji akụrụngwa a mee ka ingots mee ihe na-adịghị mma dị ka SiC?
A2:Ee. Site n'iji nlegharị anya ogologo ogologo nke laser na njikarịcha injinịa interface (dịka ọmụmaatụ, ihe ndị na-achụ àjà), enwere ike hazie ọbụna ihe ndị na-adịghị ahụkebe.

Q3: Kedu ka onye na-enye onyinye si kwado tupu ebuli laser?
A3:Sistemu ahụ na-eji modul mmezi dabere na ọhụụ sub-micron nwere nzaghachi sitere na akara fiducial yana nyocha ihe nlegharị anya elu.

Q4: Gịnị bụ oge okirikiri a na-atụ anya maka otu ọrụ ebuli elu laser?
A4:Dabere na nha wafer na ọkpụrụkpụ, usoro okirikiri a na-ahụkarị na-adị site na nkeji 2 ruo 10.

Q5: Usoro a ọ chọrọ ebe obibi dị ọcha?
A5:Ọ bụ ezie na ọ bụghị iwu na-akwadoghị, a na-atụ aro ijikọ ọnụ ụlọ dị ọcha iji nọgide na-adị ọcha na mkpụrụ ngwaọrụ n'oge arụ ọrụ dị elu.