Ngwá ọrụ semiconductor

12inch zuru oke akpaaka nkenke dicing hụrụ akụrụngwa Wafer raara onwe ya nye maka Si/SiC & HBM (Al)
Ngwa mgbanaka wafer na-akpaghị aka na-arụ ọrụ nha 8inch/12inch wafer mgbanaka ịkpụ.
Ngwa Laser Mgbochi Azụmaahịa Akara Sapphire Wafer Marking
Sistemụ akara nkwụghachi ụgwọ nke Laser maka ihe ntanetị sapphire, ọkpụkpọ elekere, ọla okomoko.
Igwe ọkụ SiC kristal SiC Ingot na-eto 4inch 6inch 8inch PTV Lely TSSG LPE usoro uto
Obere tebụl laser ọkpọ ọkpọ 1000W-6000W kacha nta oghere 0.1MM nwere ike iji metal iko seramiiki ihe.
Igwe na-egwupụta ihe laser dị elu maka sapphire ceramic material gem bearing nozzle drilling
Sapphire otu kristal Al2O3 ibu ọkụ KY usoro Kyropoulos mmepụta nke kristal sapphire dị elu.
Monocrystalline silicon ibu ọkụ monocrystalline silicon ingot eto akụrụngwa akụrụngwa okpomọkụ ruo 2100 ℃
Igwe ọkụ na-eto eto kristal Czochralski otu ọkụ kristal CZ iji too wafer sapphire dị elu.