Ngwa semiconductor
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Wafer Silicon / Silicon Carbide (SiC) Ejiri usoro nhazi polish nke nwere ogbo anọ (Ahịrị njikwa post-Polish jikọtara ọnụ)
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Ngwọta agbakwunyere nke mkpuchi mkpụrụ SiC-Bọnding-Sintering
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Sistemụ Micromachining Laser Dị Elu nke Ziri Ezi
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Waya Diamond nke nwere ọtụtụ waya maka ịkpụcha ihe siri ike ma sie ike nke ọma
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Igwe nhazi laser nke Micro Waterjet na-eduzi
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Igwe eji arụ ọrụ nke ụdị Waya Diamond nke agbanyere agbagọ
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Multi-Waya Diamond Saw TJ3000 12" Inverted Down Swing
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Ngwa Ịcha Waya maka Sapphire/Seramiki/Ihe Marble n'ịcha ihe kwụ ọtọ/kwụ ọtọ/ọtụtụ waya
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Ngwa na Ọdụ Nkwukọrịta Laser Dị Elu
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Igwe Ịcha Ncha Diamond Waya Multi-Speed High-Precision Downward Swing
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Ngwa Nchacha Akụkụ Otu Akụkụ Dị Elu
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Igwe Igwe Ngweri Ihe Mkpuchi Akụkụ Abụọ maka SiC Sapphire Si Wafer