Uru nkeSite na Glass Via (TGV)na Site Silicon Via (TSV) usoro n'elu TGV bụ tumadi:
(1) njirimara eletrik dị elu dị elu. Glass ihe onwunwe bụ ihe insulator ihe, na dielectric mgbe nile bụ nanị banyere 1/3 nke silicon ihe onwunwe, na ọnwụ ihe bụ 2-3 iwu nke ịdị ukwuu karịa nke silicon ihe, nke na-eme ka mkpụrụ ọnwụ na parasitic mmetụta belata nke ukwuu. ma na-eme ka iguzosi ike n'ezi ihe nke mgbaàmà ebufe;
(2)nnukwu size na ultra-mkpa iko mkpụrụdị mfe inweta. Corning, Asahi na SCHOTT na ndị ọzọ na-emepụta iko nwere ike inye nnukwu nha (> 2m × 2m) na iko panel ultra-thin (<50µm) na ihe ndị na-agbanwe agbanwe na-agbanwe agbanwe.
3) Ọnụ ala. Uru site na mfe ịnweta nnukwu iko panel nke ultra-thin, na ọ dịghị achọ ntinye nke mkpuchi mkpuchi, ọnụahịa mmepụta nke ihe nkwụnye iko bụ naanị ihe dịka 1/8 nke ihe nkwụnye ihe nkwụnye silicon;
4) Usoro dị mfe. Ọ dịghị mkpa idobe ihe mkpuchi mkpuchi n'elu ala na mgbidi dị n'ime TGV, ọ dịghịkwa mkpa ọ dị mkpa na efere nkwụnye ihe na-egbuke egbuke;
(5) Nkwụsi ike n'ibu. Ọbụlagodi mgbe ọkpụrụkpụ nke ihe nkwụnye ihe na-erughị 100µm, warpage ka dị obere;
(6) Ngwa dịgasị iche iche, bụ teknụzụ njikọ njikọ ogologo ogologo na-apụta nke etinyere na mpaghara nkwakọ ngwaahịa wafer, iji nweta ebe dị nso n'etiti wafer-wafer, oghere kacha nta nke njikọ njikọ na-enye ụzọ teknụzụ ọhụrụ, yana ezigbo ọkụ eletrik. , thermal, mechanical properties, na mgbawa RF, ihe mmetụta MEMS dị elu, ntinye usoro njupụta dị elu na mpaghara ndị ọzọ nwere uru pụrụ iche, bụ ọgbọ ọzọ nke 5G, 6G mgbawa elu 3D Ọ bụ otu n'ime nhọrọ mbụ maka. Ngwunye 3D nke ọgbọ na-abịa 5G na 6G ibe dị elu.
Usoro ịkpụzi nke TGV na-agụnyekarị sandblasting, ultrasonic mkpọpu mmiri, mmiri etching, miri reactive ion etching, photosensitive etching, laser etching, laser-induced omimi etching, na-elekwasị anya oghere oghere.
Nnyocha na mmepe na nso nso a na-egosi na nkà na ụzụ nwere ike ịkwadebe site na oghere na 5: 1 oghere kpuru na omimi na obosara nke 20: 1, ma nwee ọdịdị dị mma. Laser na-ebute ọnya miri emi, nke na-ebute obere nhụsianya elu, bụ usoro a kacha mụọ ugbu a. Dị ka egosiri na eserese 1, enwere mgbape doro anya n'akụkụ mgbawa laser nkịtị, ebe mgbidi gbara ya gburugburu na n'akụkụ nke etching miri emi nke laser kpatara dị ọcha ma dịkwa larịị.
Usoro nhazi nkeTGVinterposer e gosiri na Figure 2. N'ozuzu atụmatụ bụ igwu oghere na iko mkpụrụ mbụ, na mgbe ahụ tinye ihe mgbochi oyi akwa na mkpụrụ oyi akwa n'akụkụ mgbidi na elu. Ihe mgbochi mgbochi na-egbochi mgbasa nke Cu na mkpụrụ iko, ebe ọ na-amụba adhesion nke abụọ ahụ, n'ezie, na ụfọdụ ọmụmụ chọpụtakwara na ihe mgbochi mgbochi adịghị mkpa. Mgbe ahụ, a na-edobe Cu site na electroplating, mgbe ahụ, annealed, na CMP wepụrụ Cu oyi akwa. N'ikpeazụ, a na-akwadebe akwa mkpuchi RDL site na lithography mkpuchi PVD, a na-emepụta oyi akwa passivation mgbe ewepụsịrị gluu.
(a) Nkwadebe nke wafer, (b) nhazi nke TGV, (c) electroplating okpukpu abụọ - ntinye nke ọla kọpa, (d) annealing na CMP chemical-mechanical polishing, mwepụ nke elu ọla kọpa oyi akwa, (e) PVD mkpuchi na lithography. , (f) ntinye nke RDL rewiring oyi akwa, (g) degluing na Cu/Ti etching, (h) nhazi oyi akwa passivation.
Na mkpokọta,iko site oghere (TGV)Atụmanya ngwa dị obosara, na ahịa ụlọ ugbu a nọ n'ọkwa na-arị elu, site na akụrụngwa ruo imepụta ngwaahịa na nyocha na mmụba mmepe dị elu karịa nkezi ụwa.
Ọ bụrụ na enwere mmebi iwu, kọntaktị hichapụ
Oge nzipu: Jul-16-2024