Ngwakọta diamond/ọla kọpa - Nnukwu ihe na-esote!

Kemgbe 1980s, njupụta njupụta nke sekit eletrọnịkị na-abawanye na ọnụego kwa afọ nke 1.5 × ma ọ bụ ngwa ngwa. Njikọ dị elu na-eduga n'ịdị ukwuu dị ugbu a na mmepụta okpomọkụ n'oge ọrụ.Ọ bụrụ na agbasaghị nke ọma, okpomọkụ a nwere ike ime ka okpomọkụ ghara ịda mbà ma belata oge ndụ nke ngwa eletriki.

 

Iji gboo mkpa njikwa okpomọkụ na-arị elu, a na-enyocha ma na-emeziwanye ihe nkwakọ ngwaahịa eletrọnịkị dị elu nwere arụmọrụ ọkụ dị elu.

ihe mejupụtara ọla kọpa

 

Ihe mejupụtara diamond/ọla kọpa

01 diamond na ọla kọpa

 

Ihe nkwakọ ngwaahịa ọdịnala gụnyere ceramik, rọba, ọla, na alloys ha. Ceramics dị ka BeO na AlN na-egosipụta CTE ndị semiconductor dabara adaba, nkwụsi ike kemịkalụ dị mma, yana ikuku ọkụ na-agafeghị oke. Agbanyeghị, nhazi ha gbagwojuru anya, ọnụ ahịa dị elu (karịsịa BeO na-egbu egbu), yana ngwa oke na-emebi emebi. Nkwakọ ngwaahịa rọba na-enye ọnụ ala dị ala, ịdị arọ dị mfe, yana mkpuchi mana ọ na-enwe mmetụta na-adịghị mma nke okpomọkụ yana enweghị oke okpomọkụ. Ọla dị ọcha (Cu, Ag, Al) nwere conductivity thermal dị elu mana oke CTE, ebe alloys (Cu-W, Cu-Mo) na-emebi arụmọrụ ọkụ. Ya mere, ihe nkwakọ ngwaahịa akwụkwọ akụkọ na-edozi ịdị elu thermal conductivity na ezigbo CTE dị mkpa ngwa ngwa.

 

Nkwanye Nrụpụta ọkụ (W/(m·K)) CTE (×10⁻⁶/℃) Njupụta (g/cm³)
diamond 700-2000 0.9–1.7 3.52
Ahụhụ BeO 300 4.1 3.01
Akụkụ AlN 150–250 2.69 3.26
Akụkụ SiC 80–200 4.0 3.21
B₄ ụmụ irighiri ihe 29–67 4.4 2.52
eriri boron 40 ~5.0 2.6
Ihe ndị TiC 40 7.4 4.92
Al₂O₃ ụmụ irighiri ihe 20–40 4.4 3.98
SiC ntụ ntụ 32 3.4 -
Si₃N₄ ahụ 28 1.44 3.18
TiB₂ ahụ 25 4.6 4.5
SiO₂ ahụ 1.4 <1.0 2.65

 

diamond, ihe okike kacha sie ike mara (Mohs 10), nwekwara ihe pụrụ icheconductivity okpomọkụ (200-2200 W / (m·K)).

 obere ntụ ntụ

Obere ntụ ntụ diamond

 

Ọla kọpa, ya na elu thermal/electrical conductivity (401 W / (m·K)), ductility, na ọnụ ahịa arụmọrụ, na-eji ọtụtụ ebe na ICs.

 

Na-ejikọta akụrụngwa ndị a,diamond/ọla kọpa (Dia/Cu) mejupụtara-ya na Cu dị ka matriks na diamond dị ka nkwado-na-apụta dị ka ihe njikwa ọkụ na-esote ọgbọ.

 

02 Ụzọ nrụpụta isi

 

Ụzọ ndị a na-ejikarị akwadebe diamond/ọla kọpa gụnyere: ntụ ntụ metallurgy, usoro okpomọkụ dị elu na usoro nrụgide dị elu, usoro mgbaze mmiri mmiri, usoro mgbapụta plasma ntọhapụ, usoro ịgba mmiri oyi, wdg.

 

Ntụle dị iche iche nkwadebe ụzọ, usoro na Njirimara nke otu urughuru size diamond / ọla kọpa

Oke Powder metallurgy Vacuum Hot-pịa Spark Plasma Sintering (SPS) Okpomọkụ dị elu (HPHT) Oyi fesa nkwụnye ego Agbaze nbanye
Ụdị diamond MB8 HFD-D MB8 MB4 PDA MBD8/HHD
Matrix 99.8% ntụ ntụ 99.9% electrolytic Cu ntụ ntụ 99.9% Cu ntụ ntụ Alloy/dị ọcha Cu ntụ ntụ Cu ntụ ntụ dị ọcha Dị ọcha Cu nnukwu / mkpanaka
Ngbanwe interface - - - B, Ti, Si, Cr, Zr, W, Mo - -
Nha urughuru (μm) 100 106–125 100–400 20–200 35–200 50–400
Iberibe olu (%) 20–60 40–60 35–60 60–90 20–40 60–65
Okpomọkụ (°C) 900 800–1050 880–950 1100–1300 350 1100–1300
Nrụgide (MPa) 110 70 40–50 8000 3 1–4
Oge (nkeji) 60 60–180 20 6–10 - 5–30
Njupụta nke ikwu (%) 98.5 99.2–99.7 - - - 99.4–99.7
Arụmọrụ            
Nrụpụta ọkụ kacha mma (W/(m·K)) 305 536 687 907 - 943

 

 

Usoro ihe mejupụtara Dia/C nkịtị gụnyere:

 

(1)Powder metallurgy
A na-ejikọta ntụ ntụ diamond/C agwakọta ma mebie ya. Ọ bụ ezie na ọ dị ọnụ ahịa ma dị mfe, usoro a na-ewepụta oke njupụta, microstructures na-adịghị ekwekọ, na oke nlele amachibidoro.

                                                                                   Ngwakọta ọnụ

Sintering unit

 

 

 

(1)Okpomọkụ dị elu (HPHT)
N'iji igwe nrịbama multi-anvil, Cu a wụrụ awụ na-abanye n'ime lattices diamond n'okpuru ọnọdụ dị oke egwu, na-emepụta ihe mgbagwoju anya. Otú ọ dị, HPHT chọrọ ọkpụkpụ dị oke ọnụ ma ọ dịghị mma maka mmepụta nnukwu.

 

                                                                                    Cubic pịa

 

Cubic pịa

 

 

 

(1)Agbaze nbanye
Molten Cu na-abanye n'ụdị diamond site na ntinye aka na-enyere aka ma ọ bụ nbanye capillary. Ngwakọta ndị na-arụpụta na-enweta> 446 W/(m·K) conductivity thermal.

 

 

 

(2)Spark Plasma Sintering (SPS)
Pulsed ugbu a ngwa ngwa sinters agwakọta powders n'okpuru nrụgide. N'agbanyeghị na ọ na-arụ ọrụ nke ọma, arụmọrụ SPS na-eweda ala na akụkụ diamond> 65 vol.

sistemu sistemu plasma

 

Eserese nke sistemu sistemu plasma na-apụ apụ

 

 

 

 

 

(5) Oyi fesa nkwụnye ego
A na-eme ngwa ngwa ma tinye ntụ ọka n'ime mkpụrụ. Usoro a na-amalite na-eche ihe ịma aka ihu na njikwa imecha elu yana nkwenye arụmọrụ ọkụ.

 

 

 

03 Mgbanwe interface

 

Maka nkwadebe nke ihe ndị mejupụtara, imekọ ihe ọnụ n'etiti ihe ndị dị mkpa bụ ihe dị mkpa maka usoro nhazi na ihe dị mkpa na-emetụta nhazi interface na ọnọdụ njikọ njikọ. Ọnọdụ enweghị mmiri mmiri na interface dị n'etiti diamond na Cu na-eduga na nguzogide okpomọkụ dị elu. Ya mere, ọ dị oke mkpa ịme nyocha mgbanwe na njikọ dị n'etiti abụọ ahụ site na ụzọ ọrụ aka dị iche iche. Ka ọ dị ugbu a, enwere ụzọ abụọ iji meziwanye nsogbu interface dị n'etiti diamond na Cu matrix: (1) Ngwọta mgbanwe ihu igwe nke diamond; (2) Alloying ọgwụgwọ nke ọla kọpa matrix.

Matrix alloying

 

Eserese ngbanwe: (a) Ntinye ozugbo n'elu diamond; (b) Matrix alloying

 

 

 

(1) Mgbanwe elu nke diamond

 

Ịtinye ihe ndị na-arụ ọrụ dị ka Mo, Ti, W na Cr n'elu oyi akwa nke agba agba ume nwere ike melite njirimara interfacial nke diamond, si otú ahụ na-eme ka ọkụ ọkụ ya dịkwuo elu. Sintering nwere ike ime ka ihe ndị dị n'elu meghachi omume na carbon dị n'elu ntụ ntụ diamond iji mepụta oyi akwa mgbanwe carbide. Nke a na-eme ka ọnọdụ wetting dị n'etiti diamond na ntọala ígwè, na mkpuchi nwere ike igbochi nhazi nke diamond ịgbanwe na okpomọkụ dị elu.

 

 

 

(2) Alloying nke ọla kọpa matrix

 

Tupu nhazi ihe mejupụtara nke ihe, a na-eme ọgwụgwọ tupu ịwa ahụ na ọla kọpa dara, nke nwere ike imepụta ihe ndị mejupụtara ihe mejupụtara ya na n'ozuzu oke ikuku thermal. Doping ihe na-arụ ọrụ na matriks ọla kọpa nwere ike ọ bụghị naanị ibelata wetting Angle n'etiti diamond na ọla kọpa, kamakwa na-emepụta akwa carbide nke siri ike soluble na matrix ọla kọpa na diamond / Cu interface mgbe mmeghachi omume gasịrị. N'ụzọ dị otú a, ọtụtụ n'ime oghere ndị dị na interface ihe onwunwe na-agbanwe ma jupụta, si otú ahụ na-eme ka ọkụ eletrik dịkwuo mma.

 

04 Nkwubi okwu

 

Ihe nkwakọ ngwaahịa ọdịnala na-ada obere na ijikwa okpomọkụ sitere na ibe dị elu. Ngwakọta Dia/C, nwere CTE na-emegharị emegharị na ultrahigh thermal conductivity, na-anọchi anya ngwọta mgbanwe maka ngwa eletrọnịkị ọgbọ na-abịa.

 

 

 

Dị ka ụlọ ọrụ teknụzụ dị elu na-ejikọta ụlọ ọrụ na ịzụ ahịa, XKH na-elekwasị anya na nyocha na mmepe na mmepụta nke diamond / ọla kọpa na ihe ndị mejupụtara metal matrix dị elu dị ka SiC / Al na Gr / Cu, na-enye ihe ngwọta nchịkwa ọkụ ọhụrụ na-ekpo ọkụ na okpomọkụ nke n'elu 900W / (m · K) maka ubi nke nkwakọ eletriki na aerospace.

XKH'Ihe mejupụtara ihe mejupụtara ọla kọpa diamond:

 

 

 

                                                        

 

 


Oge nzipu: Mee-12-2025