Igwe ịkwọ ụgbọ mmiri ọtụtụ waya maka SiC Sapphire Ultra-Hard Brittle Materials
Okwu Mmalite nke Multi-Wire Diamond Machine Sawing Machine
Igwe na-ahụ maka diamond multi-waya bụ usoro nhazi nke ọgbara ọhụrụ emebere maka nhazi ngwa ngwa siri ike na nke na-agbaji agbaji. Site n'ibunye ọtụtụ wires ndị nwere diamond yiri ya, igwe nwere ike igbutu ọtụtụ wafer n'otu oge, na-enweta ma nnukwu mmepụta yana nkenke. Nkà na ụzụ a aghọwo ngwá ọrụ dị mkpa na ụlọ ọrụ dịka semiconductor, fotovoltaics anyanwụ, LEDs, na ceramics dị elu, karịsịa maka ihe ndị dị ka SiC, sapphire, GaN, quartz, na alumina.
E jiri ya tụnyere ịkpụ otu waya a na-ahụkarị, nhazi ọtụtụ waya na-ebuga ọtụtụ narị mpekere n'otu ogbe, na-ebelata oge okirikiri ka ọ na-edobe ọmarịcha flatness (Ra <0.5 μm) na nha nha nha (± 0.02 mm). Nhazi modular ya na-ejikọta esemokwu waya akpaghị aka, sistemu njikwa workpiece, yana nleba anya n'ịntanetị, na-ahụ na mmepụta ogologo oge, kwụsiri ike na nke zuru oke.
Nka nka nke igwe na-ahụ maka ọtụtụ waya diamond
| Ihe | Nkọwapụta | Ihe | Nkọwapụta |
|---|---|---|---|
| Ogo ọrụ kacha (Square) | 220 × 200 × 350 mm | Ụgbọ ala moto | 17.8 kW × 2 |
| Ogo ọrụ kacha (Gburugburu) | Φ205 × 350 mm | Wire mbanye moto | 11.86 kW × 2 |
| Oghere spindle | Φ250 ± 10 × 370 × 2 axis (mm) | Moto ebuli arụ ọrụ | 2.42 kW × 1 |
| Isi axis | 650 mm | moto swing | 0,8 kW × 1 |
| Waya na-agba ọsọ ọsọ | 1500 m/min | moto nhazi | 0,45 kW × 2 |
| Dayameta waya | Φ0.12-0.25 mm | moto obi erughị ala | 4.15 kW × 2 |
| Bulite ọsọ | 225 mm/min | moto slurry | 7.5kW × 1 |
| Oke. okpokoro ntụgharị | ±12° | Ikike tankị slurry | 300 L |
| Akụkụ swing | ±3° | Oyi eruba | 200 l/min |
| Ugboro ugboro | ~ ugboro 30 / nkeji | Okpomọkụ izi ezi | ±2 Celsius C |
| Ọnụego nri | 0.01–9.99 mm/min | Ịnye ọkụ | 335+210 (mm²) |
| Ọnụego nri waya | 0.01-300 mm/min | Ikuku emetụtara | 0.4–0.6 MPa |
| Nha igwe | 3550 × 2200 × 3000 mm | Ibu | 13,500 n'arọ |
Usoro arụ ọrụ nke igwe na-ahụ maka ọtụtụ waya diamond
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Multi-Wire Cutting Motion
Ọtụtụ waya diamond na-aga n'ọsọ mekọrịtara ihe ruru 1500 m/min. Puleys ndị na-eduzi nke ọma na njikwa nhụsianya mechiri emechi (15-130 N) na-eme ka wires kwụsie ike, na-ebelata ohere nke ngbanwe ma ọ bụ nkwụsị. -
Nri ziri ezi & Ndokwa
Ndokwa nke Servo na-enweta ± 0.005 mm ziri ezi. Nhazi laser nhọrọ ma ọ bụ nkwado ọhụụ na-eme ka nsonaazụ maka ụdị mgbagwoju anya. -
Ịjụ oyi na mkpochapụ
Igwe oyi dị elu na-anọgide na-ewepụ ibe ma mee ka ebe ọrụ dị jụụ, na-egbochi mmebi okpomọkụ. Multi-stage filtration gbatịrị coolant ndụ na ibelata downtime. -
Platform njikwa smart
Ndị ọkwọ ụgbọ ala servo nzaghachi dị elu (<1 ms) na-agbanwe ngwa ngwa nri, esemokwu na ọsọ waya. Njikwa nhazi ihe ejikọtara ọnụ yana otu ịpị oke ngbanwe na-eme ka mmepụta oke dị.
Uru isi nke igwe ịkwọ ụgbọ mmiri ọtụtụ waya diamond
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Nrụpụta dị elu
Nwere ike igbutu 50-200 wafers kwa ọsọ, yana mfu kerf <100 μm, na-emeziwanye ojiji ihe ruru 40%. Ntinye bụ 5–10 × nke sistemụ otu waya ọdịnala. -
Njikwa nkenke
Nkwụsi ike nkwụsi ike waya n'ime ± 0.5 N na-eme ka nsonaazụ na-agbanwe agbanwe na ihe dị iche iche na-emebi emebi. Nleba anya n'ezie na interface HMI 10 "10 na-akwado nchekwa nri na ọrụ dịpụrụ adịpụ. -
Mgbanwe, Mwube Modular
Dakọtara na dayameta waya sitere na 0.12-0.45 mm maka usoro ịkpụ dị iche iche. Ijikwa rọbọtụ nhọrọ na-enye ohere mmepụta ahịrị akpaaka zuru oke. -
Ntụkwasị obi nke ụlọ ọrụ mmepụta ihe
Ihe nkedo dị arọ / okpokolo agba arụrụ arụ na-ebelata nrụrụ (<0.01 mm). Nduzi pulley na seramiiki ma ọ bụ carbide mkpuchi na-enye ihe karịrị 8000 awa ndụ ọrụ.
Ubi ngwa nke igwe na-ahụ maka ọtụtụ waya diamond
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Semiconductors: Ịcha SiC maka modul ike EV, GaN substrates maka ngwaọrụ 5G.
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Fotovoltaics: Mpekere silicon wafer dị elu nwere otu ± 10 μm.
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LED & Optics: Mpempe sapphire maka epitaxy na ihe nhụta anya nke ọma nwere <20 μm n'akụkụ chipping.
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Ceramics dị elu: Nhazi nke alumina, AlN, na ihe ndị yiri ya maka ikuku ikuku na ihe nchịkwa okpomọkụ.
FAQ – Multi-Wire Diamond Sawing Machine
Q1: Gịnị bụ uru nke multi-waya sawing tụnyere otu-waya igwe?
A: Multi-waya Sistemu nwere ike igburi ọtụtụ iri na otu narị wafers n'out oge, na-akwalite arụmọrụ site 5-10×. Iji ihe eji eme ihe dịkwa elu yana mfu kerf dị n'okpuru 100 μm, na-eme ka ọ dị mma maka mmepụta oke.
Q2: Kedu ụdị ihe nwere ike ịhazi?
A: Emebere igwe ahụ maka ihe siri ike na nke na-adịghị ike, gụnyere silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), na aluminum nitride (AlN).
Q3: Gịnị bụ achievable izi ezi na elu àgwà?
A: Ịdị ike n'elu nwere ike iru Ra <0.5 μm, na nha nha nke ± 0.02 mm. Enwere ike ịchịkwa chipping Edge ruo <20 μm, na-ezute semiconductor na ụkpụrụ ụlọ ọrụ optoelectronic.
Q4: Usoro ịkpụ ahụ ọ na-akpata mgbawa ma ọ bụ mmebi?
A: Site na nrụgide nrụgide dị elu na njikwa nhụsianya mechiri emechi, a na-ebelata ihe ize ndụ nke micro-cracks na mmebi nchekasị, na-eme ka iguzosi ike n'ezi ihe wafer mara mma.
